Universal QFP32 to DIP Adapter Board (0.5mm Pitch)

  • Supports QFP32, TQFP/LQFP Packages with 0.5mm pitch

  • Easy IC Testing without soldering

  • Durable Test Socket for repeated use

  • Compatible with Burn-in and Development Boards

  • Ideal for Prototyping and IC Evaluation

SKU: aA1828

1.500,00 EGP

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Description

Prototyping with surface-mount components shouldn’t slow down your hardware development. This Universal QFP32 IC Adapter seamlessly bridges the gap between compact 0.5mm pitch Quad Flat Package (QFP) chips and standard 2.54mm (0.1″) breadboards. Whether you are testing a new surface-mount microcontroller, validating an RF IC, or building a custom programming jig, this breakout board allows you to easily integrate modern, miniaturized silicon into your through-hole workflows. Featuring high-quality tinned pads and clear silkscreen labeling, it is a must-have tool for any electronics workbench to prevent the need for premature custom PCB fabrication.


Key Features

  • Seamless Prototyping: Converts surface-mount QFP, TQFP, and LQFP packages into a breadboard-friendly DIP format for rapid testing and circuit development.

  • Precision Pitch: Specifically designed with a 0.5mm pin pitch to accommodate high-density 32-pin ICs accurately.

  • Standardized Output: The routed pins align perfectly with standard 2.54mm (0.1 inch) spacing, making it universally compatible with standard breadboards, perfboards, and standard socket headers.

  • High-Quality Fabrication: Built on durable FR-4 fiberglass material with pre-tinned contact pads to ensure smooth, reliable, and bridge-free hand soldering.

  • Clear Silkscreen: Features high-contrast pin numbering printed directly on the board to prevent wiring mistakes during complex project assemblies.


Technical Specifications

Specification Detail
Supported IC Packages QFP32, TQFP32, LQFP32, FQFP32
IC Pin Pitch (Input) 0.5 mm
Header Pin Pitch (Output) 2.54 mm (0.1 inch standard DIP)
Total Pin Count 32 Pins
Board Material FR-4 Glass Epoxy
Pad Finish HASL / Tinned (Ready for hand-soldering)
Dimensions ~20 mm × 20 mm (varies slightly by batch)
Rows Spacing (DIP side) Standard 600 mil or 800 mil width
 

Specification

General

WeightWeight0,0000 g
TypeIC Adapter / Test Socket
Supported ICsQFP32 (TQFP/LQFP)
Pin Pitch0.5mm
MaterialPCB & metal contacts
UsageIC programming, testing, prototyping, and development boards

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