New
MECHANIC Solder Paste XGSP30 20gm 183°C
135,00 EGP
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Description
Specification
General
| WeightWeight | 0,0000 g |
|---|---|
| Product | Lead-based Solder Paste (Sn63/Pb37) |
| Model | XGSP30 |
| Weight | 20gm |
| Melting Point | 183°C |
| Viscosity | Optimized for stencil printing and manual application |
| Application | SMD component mounting, PCB repair, and fine-pitch soldering |
