[match_prediction match_id="3"]

MECHANIC Solder Paste XGSP30 20gm 183°C

Name: MECHANIC Solder Paste XGSP30 20gm 183°C
SKU: Ek1987
Availability: InStock

MECHANIC Solder Paste XGSP30 20gm 183°C
1. Product: Lead-based Solder Paste (Sn63/Pb37)
2. Model: XGSP30
3. Weight: 20gm
4. Melting Point: 183°C

135,00 EGP

Compare

2 People watching this product now!

Description

MECHANIC Solder Paste XGSP30 is a lead-based Sn63/Pb37 solder paste designed for SMD component mounting, PCB repair, and fine-pitch soldering work.

With a melting point of 183°C, it’s formulated with a viscosity optimized for both stencil printing and manual application, giving flexibility for small-batch rework as well as more controlled stencil-based assembly.

Supplied in a 20gm quantity, this paste suits hobbyist and repair-shop soldering tasks where a reliable, standard-alloy solder paste is needed.

Features:

Lead-based Sn63/Pb37 alloy composition
Melting point: 183°C
Viscosity suited for stencil printing and manual application
20gm supply quantity
Suited for SMD mounting and fine-pitch soldering

[acf_vc_integrator get_field_data_from="" field_group="25154" field_from_25154="field_694d5bea250d3" show_label="default" align="default" gallery_columns="" gm_show_placecard="default" gm_map_type_control="default" gm_fullscreen_control="default" gm_street_view_control="default" gm_zoom_control="default" gm_scale="default" hidden_field_name="ARDUINO CODE"]

هذا الوصف والمواصفات تمت كتابته بمساعدة الذكاء الاصطناعي، يُرجى مراجعته قبل الشراء.

برجاء تأكيد الطلب على الواتساب للتأكد من توفر المخزون قبل الدفع

Specification

General

WeightWeight	0,0000 g
Product	Lead-based Solder Paste (Sn63/Pb37)
Model	XGSP30
Weight	20gm
Melting Point	183°C
Viscosity	Optimized for stencil printing and manual application