vero board PCB LINE IC FR2 (9X15 cm2) new version
Vero Board PCB LINE IC FR2 (9x15cm)
1. Material: FR2 Phenolic Paper Laminate
2. Dimensions: 9cm x 15cm, ~1.6mm thick
3. Hole Pitch: 2.54mm
4. Track Layout: Pre-etched parallel IC/line tracks
5. Thermal Resistance: Up to 260°C
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Description
This vero board is an FR2 phenolic paper laminate board pre-etched with parallel copper tracks in an IC/line layout, rather than a plain grid of isolated pads. The parallel track pattern is laid out to match standard DIP IC pin spacing, making it suited for breadboard-style prototyping where components need continuous connection runs along a row.
The board measures 9cm x 15cm (90mm x 150mm) with a thickness of about 1.6mm, and uses the standard 2.54mm (0.1″) hole grid with ~1mm hole diameter — the same pitch used by DIP ICs, headers, and most through-hole components.
Copper tracks run on the single-sided bottom layer, and the FR2 substrate is rated to withstand up to 260°C for standard soldering durations, with flame-retardant classification for added safety during assembly.
Features:
- Pre-etched parallel copper tracks (IC/line layout)
- Standard 2.54mm hole pitch, compatible with DIP packages
- Single-sided copper on FR2 phenolic paper laminate
- Board size: 9cm x 15cm, ~1.6mm thick
- Heat-resistant up to 260°C for standard soldering
- Flame retardant substrate
- Suits DIP ICs, transistors, resistors, capacitors, and Arduino/DIY circuits
Specification
Specification
| WeightWeight | 10 g |
|---|---|
| Dimensions | 5 × 4 × 2 cm |
| Material | FR2 (Phenolic Paper Laminate) |
| Track Type | Pre-etched parallel copper tracks (IC/Line layout) |
| Dimensions | 9cm x 15cm (90mm x 150mm) |
| Thickness | ~1.6mm |
| Hole Pitch | 2.54mm (0.1″) |
| Hole Diameter | ~1mm |
| Copper Layer | Single-sided (Bottom layer) |
| IC Compatibility | Standard DIP packages |
| Thermal Resistance | Up to 260°C |
| Safety Rating | Flame retardant |
| Package Contents | 1x PCB LINE IC FR2 (9x15cm) Board |
