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Soldering Wire 0.6mm|50Gm(70/30)
Product Highlights
- Ultra-Fine Precision: 0.6mm diameter designed for professional SMD and micro-soldering tasks.
- Premium 70/30 Alloy: High 70% Tin content ensures a lower melting point and superior flow.
- Mirror-Like Finish: Produces bright, shiny, and highly reliable solder joints every time.
- Built-in Rosin Core: High-quality integrated flux cleans contacts instantly for faster bonding.
- Fast Wetting Action: Quickly bonds to copper and nickel, reducing heat stress on sensitive components.
- Minimal Residue: Low-dross formula leaves a clean, non-conductive finish on your PCBs.
150,00 EGP
18
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Description
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Specification
General
| WeightWeight | 0,0000 g |
|---|---|
| Dimensions | 0,00 × 0,00 × 0,00 cm |
| Wire Diameter | 0.6 mm |
| Alloy Composition | 70% Tin (Sn) / 30% Lead (Pb) |
| Net Weight | 50 Grams (50 GM) |
| Flux Type | Rosin core (Integrated flux channels for easy wetting) |
| Flux Content | Standard 1.8% ~ 2.2% |
| Melting Point | ~183°C to 190°C (Highly fluid, low-heat thermal profile) |
| Spool Type | Durable plastic spool reel |
| Joint Appearance | Bright, shiny, and highly reliable solder joints |
| Safety Protections | Contains lead (Requires standard ventilation and hand washing after use) |
| Compatible Devices | Delicate SMD soldering, Small electronic components, PCB prototyping, Thin gauge wire joining, Mobile/Drone micro-repairs |
| Package Contents | 1× Super Solder Wire 0.6mm (50g Spool) |
