Soldering Wire 0.6mm|50Gm(70/30)
Product Highlights
- Ultra-Fine Precision: 0.6mm diameter designed for professional SMD and micro-soldering tasks.
- Premium 70/30 Alloy: High 70% Tin content ensures a lower melting point and superior flow.
- Mirror-Like Finish: Produces bright, shiny, and highly reliable solder joints every time.
- Built-in Rosin Core: High-quality integrated flux cleans contacts instantly for faster bonding.
- Fast Wetting Action: Quickly bonds to copper and nickel, reducing heat stress on sensitive components.
- Minimal Residue: Low-dross formula leaves a clean, non-conductive finish on your PCBs.
150,00 EGP
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Description
Specification
General
| WeightWeight | 0,0000 g |
|---|

