Soldering Wire 0.6mm|50Gm(70/30)

Product Highlights

  • Ultra-Fine Precision: 0.6mm diameter designed for professional SMD and micro-soldering tasks.
  • Premium 70/30 Alloy: High 70% Tin content ensures a lower melting point and superior flow.
  • Mirror-Like Finish: Produces bright, shiny, and highly reliable solder joints every time.
  • Built-in Rosin Core: High-quality integrated flux cleans contacts instantly for faster bonding.
  • Fast Wetting Action: Quickly bonds to copper and nickel, reducing heat stress on sensitive components.
  • Minimal Residue: Low-dross formula leaves a clean, non-conductive finish on your PCBs.
SKU: 1424

150,00 EGP

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Specification

General

WeightWeight0,0000 g

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