MECHANIC XG30 Solder Paste (183°C Melting Point)

Achieve professional-grade SMD and BGA soldering results with MECHANIC XG30 Solder Paste. This high-quality, ready-to-use solder paste is an essential compound for PCB assembly, hot air rework, and micro-soldering repairs.

Formulated with a standard 183°C melting point, this paste provides excellent wetting and flow characteristics, ensuring strong, shiny, and reliable solder joints. The smooth consistency makes it easy to apply using a stencil for batch PCB production or manually via a syringe for precise, component-level repairs on smartphones, laptops, and custom electronics.

Key Features

• Optimized Melting Point: Melts cleanly at 183°C, which is the industry standard for traditional Sn63/Pb37 tin-lead soldering, making it highly compatible with standard hot air rework stations and reflow ovens.

• High-Quality Flux Blend: Contains integrated active flux that minimizes oxidation during the heating process, resulting in bright, durable joints without the need for excessive secondary flux application.

• Smooth Consistency: Engineered to prevent drying and clumping, ensuring smooth, continuous application through stencils or fine-tipped dispensing needles.

• Versatile Application: The go-to choice for BGA reballing, SMD component mounting, and general micro-soldering tasks where traditional spool solder cannot reach.

• Secure Packaging: Comes in a sealed plastic tub to preserve moisture content and prolong shelf life (refrigeration recommended for long-term storage).

Technical Specifications