Soldering Wire 0.6mm|50Gm(70/30)

Product Highlights

  • Ultra-Fine Precision: 0.6mm diameter designed for professional SMD and micro-soldering tasks.
  • Premium 70/30 Alloy: High 70% Tin content ensures a lower melting point and superior flow.
  • Mirror-Like Finish: Produces bright, shiny, and highly reliable solder joints every time.
  • Built-in Rosin Core: High-quality integrated flux cleans contacts instantly for faster bonding.
  • Fast Wetting Action: Quickly bonds to copper and nickel, reducing heat stress on sensitive components.
  • Minimal Residue: Low-dross formula leaves a clean, non-conductive finish on your PCBs.
SKU: 1424

150,00 EGP

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Description

High-Precision Soldering Wire 0.6mm | 50g (70/30 Tin-Lead Alloy)

The 0.6mm 70/30 Soldering Wire is a premium-grade alloy designed for delicate
electronic repairs and professional PCB assembly. With a high 70% Tin (Sn)
content, this wire offers a significantly lower melting point and superior “wetting” action
compared to standard wires. Its ultra-fine 0.6mm diameter makes it the perfect choice for
soldering SMD components, microcontrollers, and high-density circuit boards.


Key Features

  • Superior Flow (70/30 Alloy): The high tin ratio ensures a lower melting temperature and a shiny, reliable solder joint every time.
  • Ultra-Fine Precision: The 0.6mm diameter allows for pinpoint accuracy, preventing solder bridges on tiny pins.
  • Integrated Rosin Core: Features a high-quality flux core that cleans the connection point instantly, eliminating the need for extra flux.
  • Low Dross & Residue: Leaves minimal, non-conductive residue for a clean and professional look on your electronics.
  • Fast Wetting: Bonds quickly to copper, brass, and nickel surfaces, reducing the heat-exposure time for sensitive components.

Full Technical Specifications

Attribute Details
Wire Diameter 0.6 mm (Fine Gauge)
Net Weight 50 Grams
Alloy Composition 70% Tin (Sn) / 30% Lead (Pb)
Melting Point ~183°C – 190°C
Flux Type Rosin Core (Non-Corrosive)
Flux Content 2.0% – 2.2%
Finish Bright & Shiny Joint

Common Applications

  • SMD Soldering: Perfect for 0603, 0805, and SOIC packages.
  • Mobile Repair: Ideal for micro-USB ports, FPC connectors, and small ICs.
  • Drones & Robotics: Secure wiring for flight controllers and ESCs.
  • Audio Electronics: Precision wiring for high-fidelity audio equipment and connectors.

💡 Pro Soldering Tip:

Because this wire contains 30% lead, always ensure you are working in a well-ventilated area or using a
fume extractor. For the best results with 70/30 alloy, set your soldering iron
temperature between 320°C and 350°C to achieve the perfect “mirror-like” finish.

Specification

General

WeightWeight0,0000 g

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